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OKS 1103 – Heat Sink Paste

Heat sink paste to protect sensitive electronic components against overheating.

Areas of application

  • Protection of sensitive components such as sensors, probes, measuring instruments or semiconductors, such as diodes, transistors thyristors through improving the heat linking to cooling plates or metal housings
  • For optimal cold transfer when using Peltier elements

Advantages and benefits

  • Highly effective due to good heat conductivity
  • Electrically insulating
  • Economical due to minimal consumption quantities
  • Resistant to acids and lyes
  • Without significant change in the consistency as well as constant thermal conductivity across the entire temperature range

Technical specifications

  • Operating temperature: -40 °C → +180 °C
  • Thermal conductivity: approx. 0.7 W/mK
  • Dielectric strength (20 °C): approx. 19 kV/mm
  • Thermal capacity (21 °C): approx. 1.03 J/cm³K


For optimum effect, carefully clean the contact point, e.g. with OKS 2610/OKS 2611 universal cleaner. Apply evenly and thinly to the functional surfaces with a brush, spatula, etc. Avoid excesses. Plastic based on silicone, for example silicone rubber can be attacked by silicone grease. Check compatibility before use.

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